Valentin Leung
19th April 2016, 04:50 AM
Hello,
I have a 2 shot application, I am shooting a PP substrate on a first machine, then a TPE overmold is shot over the PP.
I noticed that the bonding around the gate area of the TPE is very poor, if I pull the TPE off, I can distinctly separate the TPE from the PP, passed 10-15mm from the gate, the bonding force abruptly change to a real bonding, the PP/TPE bonding will break as I pull on it to delaminate it. I tried to process the TPE at higher/lower speed without affecting this issue.
Material are processed within their TDS windows.
Another extra information is that PP gate is close to the TPE gate, they are next to each other.
Anybody would give a guess at why?
My guess so far is that it needs to reach a certain speed hence shear, so that the plastic heats up during the fill and as it comes out of the center melt front, it can bond correctly with the PP. Raising temperature in the hot runner system would lead to black marks around gates, so I can't go that route.
It's a bit pulled by the hair though and only valid if the bonding is a temperature dependant phenomenon.
if you have any input.
Thanks
I have a 2 shot application, I am shooting a PP substrate on a first machine, then a TPE overmold is shot over the PP.
I noticed that the bonding around the gate area of the TPE is very poor, if I pull the TPE off, I can distinctly separate the TPE from the PP, passed 10-15mm from the gate, the bonding force abruptly change to a real bonding, the PP/TPE bonding will break as I pull on it to delaminate it. I tried to process the TPE at higher/lower speed without affecting this issue.
Material are processed within their TDS windows.
Another extra information is that PP gate is close to the TPE gate, they are next to each other.
Anybody would give a guess at why?
My guess so far is that it needs to reach a certain speed hence shear, so that the plastic heats up during the fill and as it comes out of the center melt front, it can bond correctly with the PP. Raising temperature in the hot runner system would lead to black marks around gates, so I can't go that route.
It's a bit pulled by the hair though and only valid if the bonding is a temperature dependant phenomenon.
if you have any input.
Thanks